In an exciting development poised to set a new benchmark in the Internet of Things (IoT) sector, Sequans Communications S.A. has introduced third-generation low-power semiconductor solutions at the Mobile World Congress 2025. These advanced semiconductors, which include two cutting-edge chips, are significant additions to Sequans’ well-regarded Calliope and Monarch IoT product lines. The primary aim behind these innovative chips is to ensure a seamless transition from the existing 4G low-speed modem categories to the more advanced 5G eRedCap standard, addressing the prevalent longevity challenges found in numerous IoT applications.
Advancements in Low-Power Semiconductor Solutions
Calliope 3: The Future of IoT Integration
Backed by the French 2030 grant awarded to Sequans in 2024, the new Calliope 3 chip builds on the exceptional capabilities of its predecessor, the Calliope 2 Cat 1bis solution. The integration of 5G NR eRedCap with LTE Cat 1bis in Calliope 3 results in a significant boost in data rates and ensures reliable, uninterrupted connectivity. This groundbreaking advancement makes the chip particularly suitable for diverse IoT solutions, including fleet management, wearables, and security devices. By consolidating two key technologies, Sequans positions Calliope 3 as an indispensable solution for IoT applications that demand high reliability and enhanced data throughput.
In addition to its superior connectivity attributes, the Calliope 3 chip demonstrates marked improvements in power consumption, making it highly efficient for battery-powered IoT devices. This improvement is achieved through advanced power-saving modes and optimized thermal management, ensuring devices remain operational and reliable over extended periods. The integration benefits extend further as the chip is designed to be compatible with existing Calliope 2 Cat 1bis modules, providing an easy migration path to 5G NR eRedCap while leveraging the same footprint and software standards. This compatibility ensures that enterprises can extend the lifespan of their IoT deployments without extensive overhauls, thus maximizing their investment returns.
Monarch 3: Leading the Charge in Ultra-Low Power Efficiency
Continuing the legacy of the Monarch 2 LTE-M/NB-IoT, the new Monarch 3 chip integrates 5G NR eRedCap with LTE-M, catering specifically to industries such as smart metering, healthcare, and asset tracking. This integration results in ultra-low power consumption and enhanced efficiency, qualities that are critical for IoT applications requiring long battery life and consistent connectivity. Monarch 3’s ability to incorporate the latest 5G technology ensures it stays ahead of the technological curve, offering industries a robust solution for their evolving connected device needs.
The ultra-low power efficiency of Monarch 3 is achieved through several innovative techniques, including intelligent power management and deep-sleep modes that extend battery life substantially. This chip’s design emphasizes seamless integration with existing Monarch 2 modules, ensuring users can upgrade without significant redesign efforts. With the introduction of Monarch 3, Sequans ensures users receive the dual benefits of cutting-edge 5G connectivity and an easy transition from their current LTE-M/NB-IoT setups, fostering a smoother evolution in their IoT infrastructure.
Strategic Insights and Market Implications
Roadmap for an IoT Future
Georges Karam, CEO of Sequans, has articulated that the commitment to innovation centers around delivering advanced cellular connectivity solutions tailored to the specific needs of IoT applications. By addressing the current market demands of reliability, power efficiency, and seamless integration, Sequans’ new chips are set to play a pivotal role in the IoT sector’s ongoing transition toward 5G. The introduction of these advanced chips comes at a crucial time when network operators and industries are gearing up to embrace 5G technology’s full potential.
Dan Shey, Vice President at ABI Research, emphasized the strategic importance of 5G eRedCap semiconductors specifically designed for IoT. As network operators transition from 4G to 5G, the demand for cost-efficient and power-efficient solutions will define the IoT landscape. Consequently, Sequans’ launch is well-poised to meet these demands and contribute to a more interconnected, energy-efficient future for IoT applications. With the distribution of samples to customers slated for 2026, Sequans is implementing a structured rollout plan that ensures its technologies are tested and refined before widespread adoption.
Showcasing at the Mobile World Congress 2025
In a groundbreaking move expected to set a new standard in the Internet of Things (IoT) industry, Sequans Communications S.A. has launched third-generation low-power semiconductor solutions at the Mobile World Congress 2025. These state-of-the-art semiconductors include two highly advanced chips that enhance Sequans’ renowned Calliope and Monarch IoT product lines. The introduction of these chips is aimed at ensuring a smooth transition from existing 4G low-speed modem categories to the more sophisticated 5G eRedCap standard. This leap addresses the widespread longevity issues that are commonly encountered in numerous IoT applications. By focusing on improving efficiency and extending the operational life of IoT devices, Sequans is paving the way for more reliable and enduring technological solutions. This advancement not only highlights Sequans’ commitment to innovation but also signifies a major step forward for the IoT landscape, promising improved performance and reliability for future applications.
